MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.
In traditional circuits, logic devices that perform computation, like transistors, and memory devices that store data are built as separate components, forcing data to travel back and forth between them, which wastes energy.
This new electronics integration platform allows scientists to fabricate transistors and memory devices in one compact stack on a semiconductor chip. This eliminates much of that wasted energy while boosting the speed of computation.
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